Process for embossing a relief pattern into a thermoplastic information carrier

摘要

There is disclosed a method for embossing a relief pattern of high resolution into a thermoplastic information carrier by means of a heatable embossing matrix. The matrix, which exhibits the desired relief pattern, is pressed onto the thermoplastic information carrier, and is then heated by means of an electric current. After the electric current has ceased, the embossing pressure is maintained until the thermoplastic information carrier has hardened through cooling. Alternative methods permits selected variation of the relief pattern to be embossed by selectively altering the surface of the support member which supports the information carrier during the embossing operation or by selectively heating the embossing matrix.