| 摘要 |
PURPOSE:To facilitate the formation of crossover wiring by a method wherein a lead electrode is made up which crosses an opened hole portion of a film of a film carrier to one side of the opened hole portion from the other side. CONSTITUTION:A continuous Cu lead terminal 31 is formed crossing an opened hole portion 5 of a semiconductor element placing portion of a tape film 3 except Cu lead terminals 4. A semiconductor element 1 is placed on the opened hole portion 5 of the tape film 3, and the semiconductor element 1 and the Cu lead are connected mechanically and electrically. The film tape is cut, and mounted onto a ceramic substrate 11. A fixed electric circuit is constituted in such a manner that a Cu lead terminal 4' is connected to a wiring pattern 12' printed on the ceramic substrate 11, the Cu lead terminal 31 is connected to wiring patterns 13' and 13'', and crossover wiring is formed. Thus, crossover wiring can be made up easily without using multilayer wiring, etc. |
