发明名称 Thermoplastic molding compositions
摘要 A thermoplastic molding composition having improved mold release properties is provided, the composition comprising a thermoplastic resin selected from the group consisting of a high molecular weight linear polyester and a high molecular weight block copolyester, from about 0.1 to 4.5% by weight, based on the total composition, of a polyolefin or olefin-based copolymer, and, optionally, from about 0.02 to 0.5% by weight, based on the total composition, of talc.
申请公布号 US4290937(A) 申请公布日期 1981.09.22
申请号 US19790043218 申请日期 1979.05.29
申请人 GENERAL ELECTRIC COMPANY 发明人 COHEN, STUART C.
分类号 C08K3/34;C08L67/02;(IPC1-7):C08L67/02 主分类号 C08K3/34
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