| 摘要 |
PURPOSE:To prevent the damage of a chip to be conveyed or the like by covering the upper surface side of a container having a recess for containing a chip with soft resin, and coating a cover via a silk cloth or sponge member from the top of the container, thereby securing the container chip. CONSTITUTION:A covering layer 6 of 1-5mm. of thick made, for example, of silicone resin is formed on a container 1 having a plurality of recesses 1a of the width to which pincers 3 are inserted for containing chips 3, made, for example, of hard resin material. Extrafine woven silk cloth 7 and sponge member 8 for fixing the chips 2 are superposed as charge preventing cover on the top of the container 1 for containing the chips 2, and a cover 5 is further coated on the top for stock or transportation. Thus, the chip 2 can be prevented from being damaged or cracked, and the container adapted for GaAs high frequency element chips, etc. can be provided. |
