发明名称 BONDING METHOD OF FACE SHEET OF PANEL
摘要 <p>PURPOSE:To provide a method of bonding face sheets of a panel wherein the thermal efficiency is good, the productivity is excellent, and positive thoroughly bonding is effected, by abutting metal face sheets on panel frames with an adhesive therebetween, interposing them between electrode plates with highly dielectric matters, and applying a high frequency voltage between the electrode plates and the face sheets. CONSTITUTION:Panel frames 1 and inner interposition members 6 to be bonded are sandwitched between the metal face plates 2, 3 with a thermosetting adhesive applied therebetween, the highly dielectric matters 7, 8 are abutted on the surfaces of the face sheets 2, 3 with the pressing electrode plates 9, 10 thereon, and a high frequency voltage is independently applied between each of the face plates 2, 3 and each of the pressing electrode plates 9, 10. The reference numerals 12, 13 indicate oscillators. Use is made of for example asbestos slates for the highly dielectric materials 7, 8. Thus when a high frequency voltage is applied, the highly dielectric matters 7, 8 are heated to cure the thermosetting adhesive so that the face sheets 2, 3, the panel frames 1 and the inner interposition members 6 are bonded.</p>
申请公布号 JPS5777528(A) 申请公布日期 1982.05.14
申请号 JP19800155700 申请日期 1980.10.31
申请人 MATSUSHITA DENKO KK 发明人 SAKAGUCHI MITSUMASA
分类号 B32B37/00;B29C53/00;B29C63/00;B29C65/00;B29C65/04;B29C65/48;B29L9/00;B29L31/10 主分类号 B32B37/00
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