| 摘要 |
PURPOSE:To manufacture the semiconductor device at low cost, and to improve the wetproof property of the device by sealing a semiconductor chip, a metallic thin wire, an island section and one part of a lead drawn to the outside in an airtight manner by an insulator substrate and sealing them with resin. CONSTITUTION:The semiconductor chip 3 is loaded on the island section 2 of the lead frames, and the lead frames 4 drawn to the outside and the chip 3 are connected by the metallic thin wires 5. The chip, the metallic thin wires, the island section and one parts of the lead frames drawn to the outside are sealed in the airtight manner by the insulator substrate 6, and sealed 1 with resin. Accordingly, the semiconductor device, which is cheaper than a ceramic vessel and has excellent wetproof property, is obtained. |
