| 摘要 |
PURPOSE:To improve the reliability of pickup by a method wherein the die is positively attracted by lifting up the wafer, on which the die was adhered, with the guide sleeve of a lifting-up needle, and then the die is separated by thrusting it up. CONSTITUTION:After the wafer has been adhered and scribed on the wafer sheet 1 and cut into the die 2, the sheet 1 is stretched out and fixed on a wafer ring 4. Then, after the wafer ring 4 has been positioned at the position where the desired die 2 can be attracted by an attracting nozzle, 3, the sleeve 9 is raised and the point of which is protruded from the upper surface 4b of the ring 4. Subsequently, after the die 2 has been picked up by raising the thrusting-up needle 7 and the sleeve 9 are lowered. Thus, by utilizing the tension of the sheet 1 without providing a vacuum attracting mechanism at the sleeve 9, the inclination of the die 2 can be prevented and a reliable pick-up operation can be performed. |
