发明名称 |
CAPSULE FOR COOLING SEMICONDUCTOR CHIPS |
摘要 |
<p>A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.</p> |
申请公布号 |
EP0001123(B1) |
申请公布日期 |
1982.06.16 |
申请号 |
EP19780100863 |
申请日期 |
1978.09.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MEEKER, ROBERT GLEN;SCANLON, WILLIAM JOSEPH;SEGAL, ZVI |
分类号 |
H05K7/20;F25D9/00;H01L23/433;H01L23/44;H01L23/473;(IPC1-7):01L23/42;01L23/44;01L23/46 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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