发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To provide a photosensitive resin composition usable for a positive type resist hard to crack and superior in adhesion to a substrate, by using a composition containing a specified ternary copolymer narrow in composition distribution, and a 1,2-quinonediazide compound. CONSTITUTION:A photosensitive resin composition contains a 1,2-quinonediazide compound, and a copolymer consisting of a conjugated diolefin compound (A), a monoolefinic unsaturated compound (B), and an alpha,beta-ethylenically unsaturated carboxylic acid (C). Said copolymer is prepared so as to have a narrow polymerization degree distribution, having >=3 plural optional standard deviation value. As the compound (A), 1,3-butadiene, isoprene, etc. are preferable. Addition of the compound (B) to the copolymer permits the mechanical characteristics of the copolymer to be properly controlled, and the solubility in an alkaline solution to be delicately adjusted in accordance with the relation of said (C) component.
申请公布号 JPS57120931(A) 申请公布日期 1982.07.28
申请号 JP19810006708 申请日期 1981.01.20
申请人 NIPPON GOSEI GOMU KK 发明人 HOSAKA YUKIHIRO;KAMOSHITA YOUICHI;HARITA YOSHIYUKI;HARADA TOKOU
分类号 C08L7/00;C08K5/16;C08K5/28;C08L9/00;C08L21/00;C08L33/00;C08L33/04;G03C1/72;G03F7/023 主分类号 C08L7/00
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