| 摘要 |
In electronic circuits, the semiconductor elements or integrated circuits which are fitted directly on an insulating carrier and are connected to electrical lead tracks on the top of the carrier produce heat which can destroy the semiconductors if the maximum permissible operating temperature is exceeded. According to the invention, the heat of such semiconductors or integrated circuits is dissipated without causing any damage by their contact surface (2) on the carrier (1) being metallised such that it conducts heat and being connected, in a manner which conducts heat, by means of heat-conductive metallised holes (4) in the carrier to a cooling surface (cold surface) (5) on the rear side of the carrier. <IMAGE>
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