发明名称 MOUNTING OF SEMICONDUCTOR PELLET
摘要 PURPOSE:To contrive substantial improvement in indexing and mounting accuracy by a method wherein a cylindrical body in which a plurality of pellets are laminated and housed, is used. CONSTITUTION:When the pellet-mounting part 22' of a lead frame 22 is fed intermittently at a point below a cylindrical body 16, the entire cylindrical body 16 is lowered to the lower dead point where the pellet 15 of the lowest layer will be approaching the fused solder 24 on the mounting part 22'. Then, when a stopper 17 is opened and evacuated in synchronization with the lowering of the cylindrical body 16, all the pellets 15 in a cylindrical body 14 are moved downward in the cylindrical body 16, and the back side of the pellet 15 of the lowest layer is placed on the solder 24 with the required load. Then, the cylindrical body 16 is raised, and at the same time, the stopper 17 is closed, and the cylindrical body 16 is raised to the upper dead point. According to this method, as the pellets are positioned in the cylindrical body and are mounted directly on the pellet mounting material in the state as they are, a sharp improvement in indexing and mounting accuracy can be contrived.
申请公布号 JPS57183043(A) 申请公布日期 1982.11.11
申请号 JP19810069143 申请日期 1981.05.07
申请人 SHIN NIPPON DENKI KK 发明人 FUKUI ITSUO
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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