| 摘要 |
PURPOSE:To form a mark only in the region of a wafer where transfer is required to be performed by a method wherein a positioning mark is formed using a mask other than the chip forming mask that was provided on a step-and-repeat exposing device. CONSTITUTION:A chip forming mask 116 is positioned in a cylinder 103, a wafer 118 is inserted in a wafer chuck, the chuck together with a stage 101 is step- and-repeated in X-Y direction, and the pattern of the mask 116 is repeatedly transferred to the transferring region for each step, excluding the transferring region for the mask formation of the wafer 118. Then, a step-and-repeat process is performed on the stage in the X-Y direction, and when the above comes in the transfer region where the mark of the wafer 118 will be formed, a beam of light is irradiated on the mask 113 exclusively used for marking, the mark pattern is reflected by a half mirror 114, and transferred on the transfer region where mark will be formed. Accordingly, on the transfer region only where necessary transfer of the wafer 118 will be performed, the positioning mark which will be used for operation in accordance with the photoetching process can be simply but highly accurately formed. |
