| 摘要 |
PURPOSE:To contrive the cost reduction of a lead frame by a method wherein only the surfaces of the tips of inner leads are plated by Au, Ag, or Ni. CONSTITUTION:Only the surfaces of the tips of inner leads 12 are plated 13 by Au, Ag, or Ni and plating is not applied to an island 11. This composition has a semiconductor element 14 is mounted on the island 11 by epoxy resin paste and the pad of the element is connected 15 to a plating layer 13. This composition remarkably reduces a manufacturing cost and the cost is reduced by 68% in the case of the number of connections 15. |
