| 摘要 |
A package for semiconductor devices, wherein at least part of the metal portion (3) of the package is plated with gold (2) and wherein a rhodium layer (1) is formed as an underplate for the gold layer. The metal portion is generally plated (5) with a metal such as nickel. The gold/rhodium combination is used as a package seal, a semiconductor mount, or a lead mount, to prevent unwanted diffusion and improve bonding. <IMAGE> |
