| 摘要 |
PURPOSE:To simplify the sealing of an IC chip and to make the device highly reliable and compact in mounting, by printing and forming thixotropic resin through a printing mask. CONSTITUTION:The IC chip 11 having a bump 12 is bonded to a circuit substrate 14 having a circuit pattern 13 with a face down attitude. The IC chip is sealed by a liquid state resin 15 so as to surround the IC chip 11. In this case, the liquid state resin (epoxy series resin and the like) having thixotripic property is printed and formed so as to surround the IC chip 11 through the printing mask 20. The IC chip 11 is mounted on a specified position of the circuit pattern 13, and the IC chip 11 is heated, fused, and bonded by the solder bump 12. At this time, the viscosity of the liquid state resin 15 is lowered by the heat at the same time, and the IC chip 11 is sealed. |
