| 摘要 |
PURPOSE:To eliminate the connecting conductive path and easily mass-produce the ceramic substrate for semiconductor package by obtaining the substrate having a highly sophisticated metallized layer through deposition of gold on the ceramic substrate with electroless plating. CONSTITUTION:Many unit substrate regions are concentrically provided on a green sheet by partitioning the boundary for each unit substrate region (a) in small area on at least one ceramic green sheet among those 12, 13, 14 having wider area. For each unit substrate region (a), metallized paste layers 21a, 31a, 41a in the specified dimensions and patterns are printed. The ceramic substrate and metallized layer formed thereon can be obtained by baking the sheet thus obtained. A gold metal layer 3 is deposited by the electroless plating on the exposed surface of each metallized layer. The substrate obtained is divided by cutting along the boundary (b) and accordingly many ceramic substrates for semiconductor package can be obtained. |
