| 摘要 |
PURPOSE:To prevent the exfoliation of the end of a semiconductor integrated circuit by forming the cut angle of the semiconductor substrate side of an alpha- ray shielding film within 30 deg.. CONSTITUTION:The active region of a semiconductor substrate and its vicinity are covered with alpha-ray shielding film of polyimide series. At this time, when etched with etchant diluted with water after it is hardened at higher than 200 deg.C, the cutting angle of the film can be set to lower than 30 deg., the stress of the film end can be dispersed, thereby preventing the exfoliation of the film. |
