| 摘要 |
PURPOSE:To make available a flat temperature distribution to a wafer mounted on a susceptor by providing thermal insulation rings on the internal and external periphery of the susceptor. CONSTITUTION:Thermal insulation rings 22 having the same quality as that of a susceptor 8 are provided on the external periphery of the susceptor 8. The ring 22 in the central portion is installed around the shaft hole of the susceptor 8, whereas the ring 22 in the external peripheral portion is installed on the upper edge of a coil cover 9. The thermal insulation rings 22 are heated by the heat induced by high frequency in the same manner as if the susceptor had a large diameter. Since the optimum temperature distribution can thus be arranged for the whole region of the susceptor, a flat temperature distribution is available to the wafer. |
