发明名称 WAERMEPUMPENANORDNUNG
摘要 <p>The heat pump arrangement is constructed for producing a number of different temperature levels from a number of module-like heat pumps (10-10d). Each heat pump contains in each case an evaporator (11), a compressor with a drive (12), a condenser (13) and an expansion valve (14) and thus in each case a self-contained refrigerating circuit, the different heat pumps being connectable together on the heat-source side (15) and/or the heat-sink side (16) by parallel or series connection in each case to form one or more circuits. In this manner, a differentiated matching of the thermodynamic processes in the refrigerating circuits to the requirements of the heat-source and heat-sink side with regard to capacities and temperatures in their temporal courses as well as the construction of heat-pump arrangements with high performance numbers is made possible. <IMAGE></p>
申请公布号 ATA129381(A) 申请公布日期 1983.11.15
申请号 AT19810001293 申请日期 1981.03.19
申请人 MITEC MODERNE INDUSTRIETECHNIK GMBH 发明人
分类号 F24D3/18;F25B29/00;(IPC1-7):F25B13/00 主分类号 F24D3/18
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