| 摘要 |
PURPOSE:To make dot density higher as well as form wiring circuits at low cost by a method in which a head portion containing a heating resistor layer is formed by a thin film formation method on the surface of a base plate and a wiring circuit is also formed by a thick film formation method on the same surface. CONSTITUTION:A graze 2 is formed in place on a base plate 1, and plural graze layers 2 are partly lapped and housed in a saw-tooth-like indented portion. Then, a head portion H consisting of a heating resistor 3, an electric conductive layer 5, and a heat-conductive layer 4 is formed on the exposed graze layer 2 by a combination of a thin film formation method (vapor deposition method, sputtering method, etc.) and a resist-etching method. Then, a lead electrode 11 to be connected with the conductive layer 5 of the head part HO is printed on the base plate 1 by a thick film formation method and a conductive layer 12 and a protective layer 13 are printed. The paste used in printing is a resin which can be baked at low temperatures of about 200 deg.C. After the baking of the paste, an electric part 14, e.g., IC, etc., is connected between the lead electrode 11 and the conductive layer 12 to complete a wiring circuit C. |
