| 摘要 |
PURPOSE:To reduce volume resistivity of a protective layer, to thicken the layer without raising residual potential, and to enhance mechanical strength, by adding copper iodide to the light transmitting protective resin layer laminated on a photoconductive layer. CONSTITUTION:Copper iodide is finely pulverized to about 1mum particle diameter, and dispersed into a binder resin, such as acrylic resin or epoxy resin to give about 10-60wt% mixture. This liquid dispersion is diluted with a solvent, and a 0.5-10mum thick protective layer contg. copper iodide is formed by spraying it on a photoconductive layer or by the like method to obtain an objective electrophotographic receptor. Addition of copper iodide into the binder resin reduces volume resistivity of the protective resin layer, suppresses the residual potential to a low value, prevents its rise, and enables thickening of the protective layer thickness. |
