发明名称 SOLDER BALL SUPPLYING DEVICE
摘要 PURPOSE:To maintain the liquid level of molten solder in the solder tank always constant at high accuracy, by replenishing solder balls into the solder tank from a solder ball supplying device according to consumption utilizing tare weight and rolling property of the solder balls. CONSTITUTION:A solder ball supplying device 10 sends solder balls 9 filled in a hopper 11 at the bottom to a ball feeder 30 by the conveyor 21 of a ball lifter 20. When solder balls 9 in the hopper 11 become scanty, a detector 12 operates and gives an alarm. A detector 31 is provided in the ball feeder 30, and when the number of solder balls exceeds a certain limit, running of the conveyor 21 is stopped automatically. Solder balls sent to an inlet pipe 2 from the ball feeder 30 are dropped by receiving a buffering action of a coil spring of the inlet pipe 2. The liquid level of the solder tank 1 is kept constant at high accuracy by making the driving motor of the conveyor 21 infinitely variable speed type, and regulating the speed by the dial 32 of the ball feeder 30, or regulating automatically according to a level sensor provided in the solder tank, or regulating by combining the both ways.
申请公布号 JPS594969(A) 申请公布日期 1984.01.11
申请号 JP19820112527 申请日期 1982.07.01
申请人 MATSUO HANDA KK 发明人 MATSUO JINSUKE
分类号 B65G65/42;B23K3/06;B65G47/78;B65G65/48;H05K3/34 主分类号 B65G65/42
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