发明名称 CERAMIC SUBSTRATE FOR SEMICONDUCTOR PACKAGE
摘要 PURPOSE:To effectively prevent the generation of damage generated at the time of handling by a method wherein when a ceramic substrate is viewed in plane, waveform parts of approx. the same waveheight are provided at end surfaces, and micro roundness is added in the direction of the thickness thereof. CONSTITUTION:A recess 30 for containing an element is formed in the ceramic substrate 10. The end surface 20 of the substrate is provided with the waveform parts 20a and 20b of approx. the same waveheight (h), when being viewed in plane, and the micro roundness 20c is added at this part in the direction of the thickness of the substrate 10. By this constitution, when the substrate 10 is moved by arrangement in a row, the substrates stably contact with each other at the waveform parts, and the frequency of collision at corners remarkably decreases. Besides, the impact due to collision of the waveform parts is alleviated by the roundness. As a result, cracks and breaks are not generated in the substrate 10. Forming the end surfaces of the parts 20a and 20b into obtuse angles is further effective.
申请公布号 JPS59119748(A) 申请公布日期 1984.07.11
申请号 JP19820231176 申请日期 1982.12.25
申请人 KIYOUSERA KK 发明人 TANOU SHIYUUZOU
分类号 H01L23/13;H01L23/00 主分类号 H01L23/13
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