发明名称 RESIN SEALING MOLD FOR SEMICONDUCTOR
摘要 PURPOSE:To prevent generation of resin burr at the lead part of a lead frame by a method wherein a resin reservoir is provided at the intermediate point of the lead in such a manner that it is interconnected to the resin introducing side of the region on the lead tip side in the tie-bar width of the lead frame. CONSTITUTION:A recessed resin reservoir 12 is provided on the opposite side of a lead frame facing the parting face of two molds which are located pinching the lead frame 2. The resin reservoir 12 provided at the intermediate point of the lead functions as the interconnected air vent located on the resin introducing side in the region 13 occupying the resion 13 which is approximately one half of the lead tip side having the width of a tie bar 3. A partition board 14 is provided in the resin reservoir 12, and its upper surface is to be coincided with the surface level of the overall parting surface. The tie-bar 3 of the lead frame is protruded several microns from the overall parting surface of the region 15 which comes in contact with the upper face of the bottom force in the width of one half of the tie-bar.
申请公布号 JPS59135735(A) 申请公布日期 1984.08.04
申请号 JP19830008768 申请日期 1983.01.24
申请人 TOSHIBA KK 发明人 MIYAMOTO MITSUGI
分类号 B22D17/22;B29C33/00;B29C61/00;B29C70/72;H01L21/56 主分类号 B22D17/22
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