发明名称 |
Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface |
摘要 |
A chip carrying module includes a number of engineering change lines buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias extending up to the upper surface of the module between each set of chips where the vias are connected by dumbbell-shaped pads including a narrow link which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads by means of fly-wires. In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire from one dumbbell-shaped pad to another. In addition, by deleting the links at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.
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申请公布号 |
US4489364(A) |
申请公布日期 |
1984.12.18 |
申请号 |
US19810337057 |
申请日期 |
1981.12.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANCE, DUDLEY A.;PLATT, ALAN;HO, CHUNG W.;RAY, SUDIPTA K. |
分类号 |
H01L23/52;H01L23/538;H05K1/00;H05K3/22;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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