| 摘要 |
PURPOSE:To prevent the damage of the corner of an element at the time of abrading, by inputting the element in the through hole of a sample protecting ring, which has a cup shape and has a reference surface at the periphery of the through hole at the central part, and polishing the element, in order to observe the semiconductor element such as an LSI with a direct-transmission type electronic microscope. CONSTITUTION:A smaple protecting ring 7 has a cup shape, has a through hole 5 at the central part, and also has a reference surface 6 at the periphery. A sample body 11, wherein a plurality of sample elements 10 are bonded, is put in the through hole 5 with a ring shaped mesh downward, and fixed to an abrading surface plate 8 by a bonding agent. The entire ring 7 is molded by a resin 12 and hardened. Then the samples 10 are mechanically polished together with the resin 12 and the ring 7. Thus the thin observing sample suitable for observation can be obtained without damaging the corner of the samples 10 and the like. |
