| 摘要 |
PURPOSE:To perform a clean drying of semiconductor wafers and to enable to dispense with the rise time of rotation when a change of absorption is performed on the semiconductor wafers by a method wherein the semiconductor wafers are supported in attractive manner by closely contacting the second vacuum nozzle which is rotating at the same rotating speed as the first vacuum nozzle. CONSTITUTION:A wet semiconductor wafer 50 is placed on the first vacuum nozzle 10 in such a manner that it is positioned in line with the center of the first vacuum nozzle 10. The electromagnetic valve 70 of the first vacuum nozzle 10 is turned ON, and when an absorption confirming switch 90 is turned ON, the first vacuum nozzle 10 is rotated in R-direction. When the number of rotation of said first vacuum nozzle 10 reaches the prescribed number of rotation, the waterdrops 60 located on the region other than the closely contacted part of the first vacuum nozzle 10 are scattered to outside the semiconductor wafer 50. When the absorption confirming switch 100 of the second vacuum nozzle 20 is turned ON, the electromagnetic valve 70 of the first vacuum nozzle 10 is turned OFF. The first vacuum nozzle 10 comes down to the point lower than the second vacuum nozzle 20, and the semiconductor wafer 50 is completely absorbed and supported by the second vacuum nozzle 20. |
