| 摘要 |
An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58) which is adapted for connection to a current source. A composite member (62) has an outer portion (64) for contacting the conductor ring (58) and an inner portion (63) for contacting peripheral regions of surface (16) of the wafer (12). Each of the portions (64 and 63) have a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends. The first ends of the elements in the outer portion (64) are for contacting the conductor (58) and the first ends of the elements in the inner portion are for contacting the surface (16). A coupling member such as a compliant metal foil (66) is contacted to and interconnects the second ends of the elements in the inner and outer portions (63 and 64). Conductive paths are completed from conductor (58) to the surface (16) and the matrix material is compressible to seal the periphery of the wafer (12) to contain ensuing plating to the surface (16).
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