| 摘要 |
PURPOSE:To reduce parasitic inductance among strip lines for signals by fixing an insulating substrate having an opening or a notch facing to a pedestal and separated wiring patterns to a base with the pedestal. CONSTITUTION:A base 5 with a projecting pedestal 4 to which a semiconductor chip must be fixed is formed by using a metal having excellent thermal conductivity such as copper. An insulator substrate, which has an opening 1A or a notch facing to the pedestal 4, on the surface thereof wiring patterns for a power supply and strip lines 2 for signals are each separated and shaped, and which consists of a metal such as alumina, is fastened to the base. The device for mounting is arranged in a cascaded manner so that the strip lines for signals are butted. Accordingly, parasitic inductance and parasitic capacitance among the strip lines can be reduced extremely. |
