| 摘要 |
PCT No. PCT/JP81/00371 Sec. 371 Date Aug. 5, 1982 Sec. 102(e) Date Aug. 5, 1982 PCT Filed Dec. 8, 1981 PCT Pub. No. WO82/02138 PCT Pub. Date Jun. 24, 1982.A multilayer circuit board provided with multilayer wiring patterns as upper and lower multilayers is provided, in which on a first circuit board 24 with a first wiring pattern 23 formed thereon a copper foil 27 is bonded through an insulating resin layer 25, the patterning is carried out so as to form a second wiring pattern 33, and the upper and lower patterns 23 and 33 are connected to each other by conductive substance 34 filled within an opening portion 32 of the second wiring pattern 33. In accordance with this multilayer circuit board, the quality thereof is improved, the manufacturing thereof is carried out at low cost, and in addition, it becomes possible to form a circuit of high density integration.
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