发明名称 MOLD FOR FILM FORMING
摘要 PURPOSE:To heat the titled mold swiftly and uniformly up to the desired temperature by a method wherein pipes to circulate thermally conductive medium are fixed to the specified positions on the external surface of the mold through joints formed by low melting point metal, flame coating metal and/or binder contained metallic powder. CONSTITUTION:The 1st electrocasting layer 14 and the 2nd electrocasting layer 16 of the electrocasting layer 12 comprising an electrocasting mold 10 are bent in the specified shape to form the molding cavity 18 on the internal side. A plurality of pipes 20 are installed at suitable intervals on the external side of the 2nd electrocasting layer 16 and fixed by the metallic flame coating layer 22 provided partially through cold flame coating to the external side of electrocasting layer 16. The metallic flame coating layer 22 as the joint is provided so that the nearly lower half of the pipe 20 is enclosed. On the further external side of the electrocasting layer 16 the backup layer 24 is provided so that the pipes 20 and the flame coating layers 22 are enclosed and the backup layer 24 sticks closely to the electrocasting layer 16. The electrocasting mold 10 can be heated or cooled rapidly by passing thermally conductive medium to the pipes 20 in a turbulent state.
申请公布号 JPS60187519(A) 申请公布日期 1985.09.25
申请号 JP19840043248 申请日期 1984.03.07
申请人 TOUKAI KASEI KOGYO KK 发明人 MATSUDA KANENORI
分类号 B29C39/10;C25D1/10 主分类号 B29C39/10
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