| 摘要 |
PURPOSE:To deal with different base widths with a carrier chute by a method wherein the bottom or both ends of the base of a semiconductor device package are provided with a guide part for positioning the guide part of the package carrier chute to the base. CONSTITUTION:The base 11 is provided with a cavity 11A containing a semiconductor pellet on the front side, and with a guide groove 20 fitting to the guide part of the package carrier chute on the back side. This guide groove 20 is provided in the longitudinal direction of the back of the base 11 in parallel to the side surface. Besides, the groove width W is smaller than the minimum dimension of the base width. The package carrier chute 10 is provided with the guide part 21 at the center, and its shape is a projection or a recess which fits to the guide groove 20 or a projection 20B. |
