| 摘要 |
PURPOSE:To unnecessitate metallic films for barrier by enabling soldering treatment at low temperatures in a neutral atmosphere by a method wherein a titanium film is formed at the part of soldering on a ceramic substrate. CONSTITUTION:A mask 32 made of a metallic thin plate and having an aperture at the part of soldering is superposed on the surface of a multilayer ceramic substrate 31, and a titanium film 33 is formed from above by sputtering. Next, a layer 34 of palladium a metal of the group VIII in the periodic law table is formed thereon by sputtering; thereafter, the mask 32 is removed. An alloy solder 35 having a weight ratio of Au 80% and Sn 20% is placed on the palladium layer 34, and an input-output electrical connection pin 36 coated with an Au coat layer 37 by plating and the like is heat-treated for 10-30min at a temperature of 300-450 deg.C. |
