发明名称 Process for the deposition of metals on semiconductor powders
摘要 Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver or palladium.
申请公布号 US4559237(A) 申请公布日期 1985.12.17
申请号 US19840666127 申请日期 1984.10.30
申请人 CIBA GEIGY CORPORATION 发明人 MEIER, KURT;BUEHLER, NIKLAUS;REBER, JEAN-FRANCOIS
分类号 C22B3/00;C22B3/44;C22B9/22;C22B15/00;C22B25/06;C22B43/00;C23C18/14;C23C18/16;(IPC1-7):B05D3/06 主分类号 C22B3/00
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