| 摘要 |
PURPOSE:To efficiently dissipate the heat generated on a semiconductor chip by a method wherein a solder bump and the terminal provided on a package substrate are electrically connected using a wiring sheet having flexible characteristics. CONSTITUTION:The entire lower surface of a semiconductor chip 1 is fixed by adhesion to the prescribed part of a package substrate 4 using a bonding agent 5. As a result, the heat generated from the semiconductor chip 1 having large power consumption can be dissipated efficiently. Then, a wiring sheet 7 is prepared, and a solder bump 2 is electrically connected to a terminal 9. Subsequently, a positioning is performed in such a manner than the terminal of the wiring 10 on the circumferential part of the wiring sheet 7 is positioned on the terminal 3 provided on the package substrate 4, and the wiring 10 and the terminal 3 are connected by applying heat or supersonic waves. At this time, a little leeway is given to the wiring sheet so that excessive force is not added even when there is an error in positioning. Also, even when the positions of the wiring sheet 7 and the terminal 3 are deviated by a small amount, the positional deviation can be absorbed by the sag of the wiring sheet 7 having leeway and the flexibility of the wiring sheet 7. |
