| 摘要 |
PURPOSE:To obtain a semiconductor device, wherein any void is never generated, and with a high heat resistance, a superior adhesive force and a good reliability by a method wherein a specific conductive bonding agent composition is used in the manufacture. CONSTITUTION:Aromatic diisocyanate and anhydride of tricarboxylic acid are caused to react at a roughly equal mol under an existence of basic solvent setting the content of resin component as 40wt% or more. Before this reaction, during this reaction or after this reaction, 0.1-1.0mol of lactam is added to 1mol of aromatic diisocyanate, 0.01-0.5mol of alcohol and/or oxime is, at need, added to 1mol of aromatic diisocyanate and the reducing viscosity is set at 0.10-0.27. This polyimide resin and a composition consisting of a conductive filling material are applied on the tab part of the lead frame in the desired pattern, the solvent is completely removed at the temperatures less than 100 deg.C and a bonding agent layer is formed. Then, a semiconductor chip is bonded by heating to the tab part at the temperatures of 250-350 deg.C. |
