| 摘要 |
PURPOSE:To prevent peeling-off or cracking, by using a polymer which is obtained by applying graft modification to an olefinic polymer by using a specific silane compound, as a humidity resistant surface protective coating resin of electronic parts. CONSTITUTION:As an olefinic polymer, for example, there are polyethylene, an alpha-olefin copolymer and an ethylenic copolymer. A silane compound to be used is one having an unsaturated double bond and there are vinyl trimethoxysilane and gamma-methacryloxypropylmethoxysilane. As a method for graft polymerization of the olefin polymer by said silane compound, there is a melt grafting method for melting and mixing both of them in the presence of a radical polymerization initiator. Thus obtained solution is applied to IC parts mounted to a ceramic substrate 2 by dripping and dried to form a resin film 5.
|
