| 摘要 |
PURPOSE:To ensure high reliability with respect to insulation and adhesive property, by bonding and fixing the inner leads of a multiple-pin leadframe by polyimide bonding film, in which a fluorine polymer having a specified melting point is made to be a fusing agent, and sealing the lead part with a resin. CONSTITUTION:The inner leads of a multiple-pin leadframe are bonded and fixed by polymide bonding film, in which a fluorine polymer having a melting point of 200-320 deg.C is made to be a fusing agent, and sealed by a resin. As the fluorine polymer, it is desirable to use the polymer including 50-76wt.% fluorine. As the fluorine polymer, a homopolymer or a copolymer of a perfluoroalkene or perfluorovinyl ether is especially suitable. Thus high temperature characteristics are improved and the following defects can be all solved: separating phenomena of the bonding agent during use: corrosion of the leadframe due to teh compositions of the bonding agent during use for a long period; and deterioration of reliability of a semiconductor element. |
