发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition curable in a short time at a low temperature, by compounding a compound having spiro-orthoester group or bicyclo-orthoester group with an organic polybasic acid (anhydride) as a hardener and an imidazole compound or a Lewis acid as a cure accelerator. CONSTITUTION:The objective composition can be produced by compounding (A) a compound having one or more spiro-orthoester group or bicyclo-orthoester group with (B) an organic polybasic acid (anhydride) as a hardener and (C) one or more specific imidazole-type and/or Lewis acid-type cure accelerators. The imidazole-type cure accelerator is e.g. imidazole, carbonylimidazole, 2-phen yl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenylimidazole, etc., and the Lewis acid-type accelerator is e.g. zinc fluoride, zinc chloride, zinc bromide, zinc iodide, guanidine tetrafluoroborate, zinc tetrafluoroborate, etc.
申请公布号 JPS61195120(A) 申请公布日期 1986.08.29
申请号 JP19850034477 申请日期 1985.02.25
申请人 TOAGOSEI CHEM IND CO LTD 发明人 KISHIMOTO YOSHIHISA;MIZUTANI KIYOKAZU;KATO HITOSHI;KATO HIROYUKI
分类号 C08G65/16;C08G65/02 主分类号 C08G65/16
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