发明名称 THROUGH HOLE INSPECTION METHOD AND APPARATUS
摘要 PURPOSE:To facilitate the control of the equipment along with a handier construction thereof, by inspecting light leaked at a defect with one matrix-like image sensing element shielding light over an opening to detect the defect on a conductive layer of a through hole. CONSTITUTION:A through hole (TH) 34 is shielded with a rod 35 and is irradiated by an illumination light 42. When any defect exists in a conductive layer 33 of the TH 34, an image on the right from the center axis of the TH 34 is reflected on the surface (r) of a prism 36 and the image on the left is reflected on the surface S while the image passing straight through the TH 34 passes straight through the prism 36 to form images at parts b1, b2 and b0 of a image sensing element. The image signals are passed through a binary coding circuit 39 and the image a' formed (a) of the TH 34 unshielded is memorized into an image memory 40 and images b0'-b2' formed at the parts b0-b2 done into a memory 41 thereby enabling highly accurate detection of a defect of the TH 34.
申请公布号 JPS61202146(A) 申请公布日期 1986.09.06
申请号 JP19850044072 申请日期 1985.03.06
申请人 FUJITSU LTD 发明人 MITA KIKUO;ANDO MORITOSHI
分类号 H05K3/00;G01N21/88;G01N21/956 主分类号 H05K3/00
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