| 摘要 |
PURPOSE:To obtain a fine and precise metallic mold having good quality by forming a metallic layer having a good release characteristic from a plating layer on an original plate, subjecting the film to plating and stripping the plat ing. CONSTITUTION:A step layer 2 consisting of SiO2, etc. is formed on a substrate 1 consisting of silicon wafer, etc. A material 3 such as silicate glass which can be fluidized by heat is formed on the substrate 1 including the step layer 2 and is heat-treated, by which a slope 6 having a very small angle is formed. A metallic film 4 consisting of MoSi2, etc. having the good release characteristic from a plating metal such as Mo is deposited thereon by a sputtering method, etc. and Mo or the like is sputtered thereon to form a plating metallic film 5. W, Ti, Nb, Ta, etc. are adopted in addition to Mo for the plating metal. The film 5 is stripped and the metallic mold for plastic molding, etc. is obtd.
|
