| 摘要 |
PURPOSE:To realize high density mounting of semiconductor elements by a method wherein the semiconductor elements are arranged and joined on both sides of a wiring board in such a manner that the semiconductor elements overlap upon each other at least partially in the cross section. CONSTITUTION:A semiconductor element 1 is fixed in the recessed part of a wiring board 8 with fixing adhesive and, after wire bonding, molding 2 is performed. Then another semiconductor element 1 is joined with the wiring board 8 in a face-down manner. This arrangement and junction are made in such a manner that the two semiconductor elements overlap upon each other at least partially in the cross section. As a result, a large number of semiconductor elements can be mounted without increasing the surface area of the wiring board. |
