| 摘要 |
PURPOSE:To reduce a mounting area of electronic elements and improve reliabil ity by a method wherein the electronic elements are mounted on a semiconduc tor and covered with protective material. CONSTITUTION:The part of a board 2 on which a semiconductor 1 is mounted is coated with adhesive 8. After coating, the semiconductor 1 is mounted. Then electronic elements 5 are positioned on bumps 4 and heating, vibration and so forth are applied to the electronic elements 5, bumps 4 and so forth while a proper load is being applied to the electronic elements 5. After that the electronic elements are wired and covered with protective material. As the electronic elements, which are customarily mounted on the board, are mounted on the semiconductor, the area of the board can be reduced substantially. Also the reliability is improved by protecting the electronic element with the protective material. |
