| 摘要 |
PURPOSE:To provide the titled material having excellent moisture resistance, by blending an epoxy resin with a hardener, a curing accelerator, an inorg. filler and a fluororesin surface improver. CONSTITUTION:An epoxy resin having at least one epoxy group per molecule (e.g., a phenolic novolak) is blended with a hardener such as maleic anhydride, a curing accelerater such as various imidazole compds., an inorg. filler such as CaCO3, a fluororesin surface improver such as a perfluoroacrylate/dodecyl methacrylate copolymer and optionally a parting agent, a colorant, a flame retarder, etc. The mixture is mixed in a mixing roll mill to obtain an epoxy resin molding material for use in semiconductor sealing.
|
