| 摘要 |
PURPOSE:To enable the face down bonding process to be performed with high precision by a method wherein the positional deflection of a chip on a chip loader is detected by a first camera to correct the rough movement thereof and after detecting the positional deflection of a substrate on a steam by a second and the third camera for alignment with high precision, the chip is bonded on the substrate. CONSTITUTION:When a turntable 9 is turned in the turning direction intermittently shifting from a loader part A to a defective part discharging part B, a tool rough movement correcting part C, a tool fine movement correcting part D, a bonding part E and a spare station F, the loader part A detects the main surface of a chip loaded on a chip loader 13 with a first camera 14 to check any positional deflection in the turning direction while the rough movement correcting part C corrects the rough movement of chip held by a tool 11. The position of tool of the tool fine movement correcting part D shifting to the bonding part E and the position of substrate are corrected by the data detected by a second camera 16 and the third camera 25 later to bond the chip on the substrate. Through these procedures, the bonding process can be performed with high precision.
|
