| 摘要 |
PURPOSE:To obtain a diode which does not form voids in case of sealing a semiconductor diode with glass by glass-sealing a plurality of mesa pellets between heat sink leads to be laminated so that mesa grooves are opposed to laminate the pellets. CONSTITUTION:When a heat sink 3a is used as a positive electrode and a heat sink 3b is used as a negative electrode, substrates are sequentially laminated from the positive electrode side through P-type pellet 1a, N-type pellets 1b, P-type pellet 1c and N-type pellet 1d. The pellets 1a-1c are bonded completely at all surfaces to be bonded by depositing brazing materials on both side surfaces by glass-sealing while pressing with the sinks 3a, 3b. At this time the opposed mesa grooves are integrated to form a spherical surface, the glass is sufficiently filled in this position to eliminate voids. |
