| 摘要 |
PURPOSE:To reduce the invasion of moisture from the exterior to a resin-sealed semiconductor device by bending a part of hanging leads supported to hang a semiconductor element placing unit of a lead frame from an outer frame in a thicknesswise direction to form a recess. CONSTITUTION:A hanging lead 3 formed on the same surface as a semiconductor element placing unit 2 is bent at the intermediate in a < shape in a thicknesswise direction to be recessed. The unit 2 for placing a semiconductor element 5 and an element placing unit 2 are hung from an outer frame 1. A lead frame having hanging leads 3 formed at the intermediate in a recess 3a, hung at the unit 2 from the frame 1 is formed by pressing an iron-nickel alloy, sealed with resin 7, and the lead 3 is cut at the root of the resin 7. When the lead frame is formed by etching, a desired pattern is formed, the leads of the semiconductor element placing unit is bent by pressing. |
