发明名称 HEAT SINK
摘要 PURPOSE:To enable stable temperature measurement and to decrease the number of processes and the time required for attaching a temperature sensor, by providing a heat sink with a path through which the temperature sensing section of the sensor is inserted to be close to the heat dissipating surface of a heat generating body when the heat generating body is mounted on the heat sink. CONSTITUTION:A transistor 2 is attached to a heat sink 1 by means of a mounting screw 3 such that the heat dissipating surface of the transistor 2 is closely contacted with the attaching surface 1b of the heat sink l. In order to measure a temperature, a heat-conducting compound is injected into a through hole la in the heat sink 1 and a heat sensing section of a temperature sensor is inserted therein. In this manner, the temperature can be measured easily and stably.
申请公布号 JPS62226646(A) 申请公布日期 1987.10.05
申请号 JP19860070135 申请日期 1986.03.27
申请人 NEC CORP 发明人 KIDO SUSUMU
分类号 H01L23/36;H01L23/34 主分类号 H01L23/36
代理机构 代理人
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