发明名称 RADIATION SENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition capable of forming a polyimide cured film having excellent heat-resisting and solvent-resisting properties by radiating the titled composition by comprising the composition of a solution which dissolves a specific polyimide and an aromatic bisazide compd. in a solvent so as to contain >=95wt% the total of the specific polyimide and the aromatic bisazide compd. on the weight basis of the solid contg. in said solution. CONSTITUTION:The titled composition is composed of the solution which dissolves the polyimide and the aromatic bisazide compd. in the solvent. Said polyimide and the aromatic bisazide compd. are obtd. by reacting an aliphatic tetracarboxylic acid or its anhydride and a diamine compd. or a diisocyanate compd. And, said solution contains >=95wt% the total of the polyimide and the aromatic bisazide compd. on the weight basis of the solid contd. in the solution. Thus, the titled composition capable of forming the polyimide cured film having excellent heat-resisting and solvent-resisting properties by radiating the radiation such as a visible ray is obtd.
申请公布号 JPS62280736(A) 申请公布日期 1987.12.05
申请号 JP19860124319 申请日期 1986.05.29
申请人 JAPAN SYNTHETIC RUBBER CO LTD 发明人 YOKOYAMA YASUAKI;GOTO KOHEI;IKEDA HIROHARU
分类号 C08L79/08;C08K5/28;G03F7/008;G03F7/012;G03F7/037;G03F7/038;H05K3/06;H05K3/28;H05K3/46 主分类号 C08L79/08
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