发明名称 METHOD FOR REMOVING SOLUTION
摘要 PURPOSE:To reduce the amount of a plating soln. sticking to a work and a work hanging jig by pulling up them from a plating cell at a prescribed speed in a plating stage so as to leave the plating soln. sticking to them in the plating cell. CONSTITUTION:In a plating stage, a work and a work hanging jig are pulled up from a plating cell at >=20mm/sec speed so as to reduce the amount of a plating soln. sticking to them by the surface tension of the plating soln. in the plating cell. Thus, the amount of the plating soln. brought out of the plating cell is reduced.
申请公布号 JPS62280400(A) 申请公布日期 1987.12.05
申请号 JP19860122751 申请日期 1986.05.28
申请人 SEIKO EPSON CORP 发明人 KASAI SHIGERU
分类号 C25D21/00 主分类号 C25D21/00
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